Organic light emitting display apparatus

ABSTRACT

Provided is an organic light emitting display apparatus. The organic light emitting display apparatus includes: a substrate; a display unit disposed on the substrate; an encapsulation layer covering the display unit; an integrated circuit device disposed on an outer portion of the display unit on the substrate; and a transparent protection unit (window) disposed on the encapsulation layer and separated from the integrated circuit device.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 15/177,106, filed Jun. 8, 2016, which is acontinuation application of U.S. patent application Ser. No. 14/708,580,filed May 11, 2015, and issued as U.S. Pat. No. 9,391,297, which is acontinuation application of U.S. patent application Ser. No. 14/012,285,filed Aug. 28, 2013, and issued as U.S. Pat. No. 9,029,858, and claimspriority from and the benefit of Korean Patent Application No.10-2013-0000638, filed Jan. 3, 2013, each of which is herebyincorporated by reference for all purpose as if fully set forth herein.

BACKGROUND OF THE INVENTION Field of the Invention

An embodiment of the present invention relates to an organic lightemitting display apparatus, and more particularly, to a slimmer organiclight emitting display apparatus.

Description of the Related Art

In general, an organic light emitting display apparatus includes anorganic light emitting device disposed on a display unit, and theorganic light emitting device includes a pixel electrode that faces anopposite electrode and an emission layer disposed between the pixelelectrode and the opposite electrode. Such an organic light emittingdevice is vulnerable to external moisture or oxygen, and thus, theorganic light emitting device is encapsulated so that externalimpurities may not infiltrate therein.

To encapsulate an organic light emitting device, an encapsulationsubstrate having a predetermined thickness or greater has beencontemporarily used. Because the encapsulation substrate is thick,however, a total thickness of the organic light emitting displayapparatus disadvantageously increases.

Accordingly, to make a slimmer organic light emitting display apparatus,a method of encapsulating the organic light emitting device by using afilm instead of using an encapsulation substrate, has been suggested.When the organic light emitting device is encapsulated by a film, theorganic light emitting device and the organic light emitting displayapparatus become thinner.

An integrated circuit device may be disposed on a substrate of anorganic light emitting display apparatus as a chip-on-class type.Therefore, if a thickness of the integrated circuit device is greaterthan a thickness of the organic light emitting device and the film, theintegrated circuit device may contact a structure disposed on the film.Since the integrated circuit device is weak against external shock, theintegrated circuit device may break when contacting the structuredisposed on the film.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the describedtechnology and therefore it may contain information that does not formthe prior art that is already known in this country to a person ofordinary skill in the art.

SUMMARY OF THE INVENTION

An embodiment of the present invention provides a slim organic lightemitting display apparatus that is highly applicable.

According to an aspect of the present invention, there is provided anorganic light emitting display apparatus including: a substrate; adisplay unit disposed on the substrate; an encapsulation layer coveringthe display unit; an integrated circuit device disposed on an outerportion of the display unit on the substrate; and a transparentprotection unit (window) disposed on the encapsulation layer andseparated from the integrated circuit device.

The transparent protection unit may extend longer than the substrate,and the integrated circuit device may be disposed under the transparentprotection unit.

The substrate may extend longer than the encapsulation layer, and theintegrated circuit device may be disposed on an extended region of thesubstrate.

The integrated circuit device may be disposed on an edge portion of thesubstrate.

The encapsulation layer may be formed by alternately stacking one ormore organic layers and one or more inorganic layers.

A first recess may be formed in the substrate on an outer portion of theencapsulation layer, and the integrated circuit device may be disposedin the first recess.

The first recess may have a depth that is less than a thickness of theintegrated circuit device.

The thickness of the integrated circuit device may be greater than a sumof a thickness of the display unit and a thickness of the encapsulationlayer.

The depth of the first recess may be greater than a value that isobtained by subtracting the sum of the thickness of the display unit andthe thickness of the encapsulation layer from the thickness of theintegrated circuit device.

The thickness of the integrated circuit device may be less than a heightfrom the first recess to the transparent protection unit.

According to another aspect of the present invention, there is providedan organic light emitting display apparatus including: a substrate; adisplay unit disposed on the substrate; an encapsulation layer coveringthe display unit; an integrated circuit device disposed on an outerportion of the display unit on the substrate; and a transparentprotection unit disposed on the encapsulation layer and separated fromthe integrated circuit device. The transparent protection unit has asecond recess in a portion geometrically corresponding to the integratedcircuit device, and a part of the integrated circuit device is in thesecond recess.

The transparent protection unit may extend longer than the substrate,and the integrated circuit device may be disposed under the transparentprotection unit.

The substrate may extend longer than the encapsulation layer, and theintegrated circuit device may be disposed on an extended region of thesubstrate.

The integrated circuit device may be disposed on an edge portion of thesubstrate.

The encapsulation layer may be formed by alternately stacking one ormore organic layers and one or more inorganic layers.

The second recess may have a depth that is less than a thickness of theintegrated circuit device.

The thickness of the integrated circuit device may be greater than a sumof a thickness of the display unit and a thickness of the encapsulationlayer.

The depth of the second recess may be greater than a value that isobtained by subtracting the sum of the thickness of the display unit andthe thickness of the encapsulation layer from the thickness of theintegrated circuit device.

The thickness of the integrated circuit device may be less than a heightfrom the substrate to the second recess.

A buffer unit may be formed in the second recess.

The transparent protection unit may include a protrusion on an oppositesurface to the region where the second recess is formed.

According to still another aspect of the present invention, there isprovided an organic light emitting display apparatus including: asubstrate; a display unit disposed on the substrate; an encapsulationlayer covering the display unit; an integrated circuit device disposedon an outer portion of the display unit on the substrate; and atransparent protection unit disposed on the encapsulation layer andseparated from the integrated circuit device. A first recess is formedin the substrate on an outer portion of the encapsulation layer, and asecond recess is formed in the transparent protection unit on a portiongeometrically corresponding to the integrated circuit device. Theintegrated circuit device is disposed in the first recess and a part ofthe integrated circuit device is disposed in the second recess.

A thickness of the integrated circuit device may be greater than a sumof a thickness of the display unit and a thickness of the encapsulationlayer.

A sum of a depth of the first recess and a depth of the second recessmay be greater than a value that is obtained by subtracting the sum ofthe thickness of the display unit and the thickness of the encapsulationlayer from the thickness of the integrated circuit device.

The thickness of the integrated circuit device may be less than a heightfrom the first recess to the second recess.

A buffer unit may be formed in the second recess.

The transparent protection unit may include a protrusion on an oppositesurface to the region where the second recess is formed.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention, and many of the attendantadvantages thereof, will be readily apparent as the same becomes betterunderstood by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings in which likereference symbols indicate the same or similar components, wherein:

FIG. 1 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus according to an embodiment ofthe present invention;

FIG. 2 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus according to another embodimentof the present invention;

FIG. 3 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus according to another embodimentof the present invention; and

FIG. 4 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus according to another embodimentof the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Although a few embodiments of the present invention have been shown anddescribed, it would be appreciated by those skilled in the art thatchanges may be made in these exemplary embodiments without departingfrom the principles and spirit of the invention, the scope of which isdefined in the claims and their equivalents.

It will be understood that although the terms ‘first’ and ‘second’ areused herein to describe various elements, these elements should not belimited by these terms. These terms are only used to distinguish oneelement from another element. Thus, a first element discussed belowcould be termed a second element, and similarly, a second element may betermed a first element without departing from the teachings of thisdisclosure.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this inventive concept belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items. Expressions such as “atleast one of,” when preceding a list of elements, modify the entire listof elements and do not modify the individual elements of the list.

Hereinafter, embodiments of the present invention will be described indetail with reference to accompanying drawings.

FIG. 1 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus 1 according to an embodiment ofthe present invention.

In reference to FIG. 1, the organic light emitting display apparatus 1may include a substrate 110, a display unit 120, an encapsulation layer130, an integrated circuit device 140, and a transparent protection unit(window) 150.

The display unit 120 may be disposed on the substrate 110, and theencapsulation layer 130 may cover the display unit 120. In oneembodiment, the encapsulation layer 130 may completely cover the displayunit 120. Also, the integrated circuit device 140 may be disposed on thesubstrate 110 at an outer side of the display unit 120. Also, thetransparent protection unit 150 may be disposed on the encapsulationlayer 130. In addition, the transparent protection unit 150 and theintegrated circuit device 140 are separated from and spaced apart fromeach other.

The substrate 110 may be formed of various materials, for example,glass, metal, or plastic.

The substrate 110 may extend so as to have a length that is longer thanthat of the encapsulation layer 130, and the integrated circuit device140 may be disposed on an extended region A of the substrate 110.

A first recess 113 may be formed in the substrate 110 at an outer sideof the encapsulation layer 130. The first recess 113 may be formedsimultaneously with the formation of the substrate 110, or may be formedby removing a part of the substrate 110 by using an etchant or a laserablation method after the formation of the substrate 110 having flatsurfaces. In addition, the integrated circuit device 140 may be disposedin the first recess 113. Also, a depth D1 of the first recess 113 may beless than a thickness T1 of the integrated circuit device 140.

The display unit 120 is disposed on the substrate 110. The display unit120 may include a plurality of organic light emitting devices.

The encapsulation layer 130 may be formed of an organic material or aninorganic material. In particular, if the encapsulation layer 130 isformed only by using an organic layer or an inorganic layer, externaloxygen or moisture may infiltrate through fine passages formed in afilm, and thus, the encapsulation layer 130 having a multi-layeredstructure may be formed by stacking organic layers and inorganic layersalternately. When such a composite layer of organic/inorganic layers isused, an organic layer may be formed of, for example, an acryl-basedmaterial, and an inorganic layer may be formed of, for example,aluminium oxide. The display unit 120 and the encapsulation layer 130will be described in more detail with reference to FIG. 4 below.

The integrated circuit device 140 may be disposed on the substrate 110at the outer side of the display unit 120 to control light emission fromthe display unit 120. That is, the integrated circuit device 140 may bedisposed on the substrate 110 as a chip on glass (COG) type. Also, inthis case, the integrated circuit device 140 may be disposed under thetransparent protection unit 150 disposed on the display unit 120. Inaddition, the integrated circuit device 140 may be disposed on an edgeportion of the substrate 110. The integrated circuit device 140 includesa main body (not shown) and a bump (not shown), and is electricallyconnected to a pad (not shown) extending from the display unit 120 toapply electric signals to the display unit 120.

The transparent protection unit 150 may be disposed on the encapsulationlayer 130. Also, the transparent protection unit 150 may be separatedfrom and spaced apart from the integrated circuit unit 140. Thetransparent protection unit 150 may be attached to a housing (not shown)by an adhesive member (not shown). Also, the transparent protection unit150 may extend so as to have a length that is longer than that of thesubstrate 110. In addition, the integrated circuit device 140 may bedisposed under the transparent protection unit 150.

The thickness T1 of the integrated circuit device 140 may be greaterthan or less than the sum T2 of the thickness of the display unit 120and the thickness of the encapsulation layer 130.

If the thickness T1 of the integrated circuit device 140 is less thanthe sum T2 of the thickness of the display unit 120 and the thickness ofthe encapsulation layer 130, the integrated circuit device 140 isdisposed on the outer side of the display unit 120 and below thetransparent protection unit 150 on the substrate 110, and at the sametime, the integrated circuit device 140 may be separated from thetransparent protection unit 150.

However, the thickness T1 of the integrated circuit device 140 isgenerally greater than the sum T2 of the thickness of the display unit120 and the thickness of the encapsulation layer 130. In this case, whenthe integrated circuit device 140 is disposed on the substrate 110, theintegrated circuit device 140 contacts the transparent protection unit150 disposed on the encapsulation layer 130. Since the integratedcircuit device 140 has a low breaking strength, when the integratedcircuit device 140 contacts the transparent protection unit 150, theintegrated circuit unit 140 is vulnerable to external shock.

Therefore, if the thickness T1 of the integrated circuit device 140 isgreater than the sum T2 of the thickness of the display unit 120 and thethickness of the encapsulation layer 130, the first recess 113 may beformed in the substrate 110 on the outer side of the encapsulation layer130. Here, a depth D1 of the first recess 113 may be greater than avalue obtained by subtracting the sum T2 from the thickness T1 of theintegrated circuit device 140. When the integrated circuit device 140 isdisposed in the first recess 113 formed as described above, thethickness T1 of the integrated circuit device 140 may be less than aheight H1 measured from the bottom surface B of the first recess 113 tothe lower surface of the transparent protection unit 150. That is, whenthe integrated circuit device 140 is disposed in the first recess 113 ofthe substrate 110, the integrated circuit device 140 may be separatedfrom the transparent protection unit 150. That is, since the integratedcircuit device 140 is separated from the transparent protection unit150, a direct transfer of an external shock to the integrated circuitdevice 140 may be prevented. As such, the organic light emitting displayapparatus 1 may be manufactured slimmer, and at the same time, damage tothe integrated circuit device 140 may be prevented, thereby improvingthe reliability of the organic light-emitting display apparatus 1.

FIG. 4 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus according to another embodimentof the present invention. The display unit 120 and the encapsulationlayer 130 will be described in detail with reference to FIG. 4.

In reference to FIG. 4, the organic light emitting display apparatusincludes the substrate 110, the display unit 120 including an organiclight emitting device 20, and the encapsulation layer 130.

The organic light emitting device 20 and a thin film transistor (TFT) 10connected to the organic light emitting device 20 are disposed on thesubstrate 110. Although FIG. 4 shows one organic light emitting device20 and one TFT 10 for convenience of description, the organic lightemitting display apparatus according to the present embodiment mayinclude a plurality of organic light emitting devices 20 and a pluralityof TFTs 10.

The organic light emitting display apparatus may be classified as apassive matrix (PM) type and an active matrix (AM) type according towhether the organic light emitting device 20 is driven by a TFT. Theorganic light emitting display apparatus of the present embodiment maybe applied to any of the PM type and the AM type display apparatuses.Hereinafter, an AM type organic light emitting display apparatus will bedescribed as an example.

A buffer layer 31 formed of SiO₂ and/or SiNx may be further formed onthe substrate 110 for planarizing the substrate 110 and preventingimpurity ions from infiltrating into the substrate 110.

An active layer 11 of the TFT 10 is formed of a semiconductor materialon the buffer layer 31. The active layer 11 may be formed ofpolycrystalline silicon; however, the present invention is not limitedthereto, and the active layer 11 may be formed of oxide semiconductor.For example, the oxide semiconductor may include an oxide of a materialselected from Group 12, Group 13, and Group 14 metal elements such aszinc (Zn), indium (In), gallium (Ga), tin (Sn), cadmium (Cd), germanium(Ge), and hafnium (Hf), and combinations thereof. For example, theactive layer 11 may include G-I-Z-O[(In₂O₃)a(Ga₂O₃)b(ZnO)c] (a, b, and care real numbers respectively satisfying conditions a≧0, b≧0, and c>0).

A gate insulating layer 32 is formed to cover the active layer 11. Agate electrode 12 is formed on the gate insulating layer 32, and aninterlayer dielectric 33 is formed to cover the gate electrode 12. Asource electrode 13 and a drain electrode 14 are formed on theinterlayer dielectric 33, and a passivation layer 34 and a planarizationlayer 35 are sequentially formed in this order to cover the source anddrain electrodes 13 and 14.

The gate insulating layer 32, the interlayer dielectric 33, thepassivation layer 34, and the planarization layer 35 may be formed of aninsulating material to have single-layered or multi-layered structuresincluding an inorganic material, an organic material, or anorganic/inorganic compound material. The above stacked structure of theTFT 10 is an example, and TFTs with various structures may be used.

A first electrode 21 that is an anode electrode of the organic lightemitting device 20 is formed on the planarization layer 35, and a pixeldefine layer 36 is formed of an insulating material to cover the firstelectrode 21. A predetermined opening is formed in the pixel definelayer 36, and an organic emission layer 22 of the organic light emittingdevice 20 is formed in a region defined by the opening. In addition, asecond electrode 23 that is a cathode electrode of the organic lightemitting device 20 is formed to cover all pixels. Polarities of thefirst electrode 21 and the second electrode 23 may be exchanged.

The first electrode 21 may be formed as a transparent electrode or areflective electrode. If the first electrode 21 is formed as atransparent electrode, the first electrode 21 may be formed of indiumtin oxide (ITO), indium zinc oxide (IZO), ZnO, or In₂O₃. If the firstelectrode 21 is formed as a reflective electrode, the first electrode 21may include a reflective layer formed of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd,Jr, Cr, or a compound thereof, and a film formed of ITO, IZO, ZnO, orIn₂O₃ on the reflective layer. The second electrode 23 may be formed asa transparent electrode or a reflective electrode. If the secondelectrode 23 is formed as a transparent electrode, the second electrode23 may include a film formed by depositing Li, Ca, LiF/Ca, LiF/Al, Al,Mg, or compound thereof to face the organic emission layer 22, and anauxiliary electrode or a bus electrode line formed of a transparentelectrode forming material such as ITO, IZO, ZnO, or In₂O₃ on the film.In addition, if the second electrode 23 is formed as a reflectiveelectrode, the second electrode 23 may be formed by depositing Li, Ca,LiF/Ca, LiF/Al, Al, Mg, or a compound thereof.

The organic emission layer 22 formed between the first and secondelectrodes 21 and 23 may be formed of a low molecular weight or a highmolecular weight organic material. If a low-molecular weight organicmaterial is used, then the organic emission layer 22 may have a singleor multi-layer structure including at least one selected from the groupconsisting of a hole injection layer (HIL), a hole transport layer(HTL), an emission layer (EML), an electron transport layer (ETL), andan electron injection layer (EIL). Examples of available organicmaterials may include copper phthalocyanine (CuPc),N,N′-di(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB),tris-8-hydroxyquinoline aluminum (Alq₃), and the like. The low molecularweight organic material may be vacuum deposited by using masks.

If a high-molecular weight organic material is used, the organicemission layer 22 may have a structure further including an HTL (notshown) toward the anode electrode. Here, the HTL may be formed ofpoly(3,4-ethylenedioxythiophene) (PEDOT), and the EML may be formed of apolymer organic material based on polyphenylene vinylene (PPV) andpolyfluorene.

In the above embodiment, the organic emission layer 22 is formed in theopening of the pixel defining layer 36, and a luminescent material isformed separately in each pixel; however, the present invention is notlimited thereto. That is, in one embodiment, the organic emission layer22 may be formed commonly throughout on the entire pixel define layer 36without regard to locations of pixels. Here, the organic emission layer22 may be formed by stacking layers including light emitting materialsemitting red, green, and blue light, for example, in a verticaldirection or combining the layers. Also, if white light is emitted,other colors may be combined. In addition, a color conversion layer or acolor filter for converting the white light into a predetermined colorlight may be further formed.

However, the organic light emitting device 20 easily deteriorates due tomoisture or oxygen, and thus, the encapsulation layer 130 is disposed tocover the display unit 120 in which the organic light emitting device 20is located, as described above.

The encapsulation layer 130 may be formed by alternately stacking one ormore organic layers and one or more inorganic layers.

A plurality of inorganic layers and a plurality of organic layers may bestacked.

The organic layer is formed of a polymer, for example, may be a singlelayer or a stacked layer formed of one selected from polyethyleneterephthalate, polyimide, polycarbonate, epoxy, polyethylene, andpolyacrylate. For example, the organic layer may be formed ofpolyacrylate, in more detail, may include a polymerized monomercomposition including diacrylate-based monomer and triacrylate-basedmonomer. The monomer composition may further include monoacrylate-basedmonomer. Also, the monomer composition may further include aphotoinitiator such as TPO; however, the present invention is notlimited thereto.

The inorganic layer may be a single layer or stacked layers includingmetal oxide or metal nitride. In particular, the inorganic layer mayinclude one of SiNx, Al₂O₃, SiO₂, and TiO₂.

The uppermost layer of the encapsulation layer 130, which is exposed tothe outside, may be formed of an inorganic layer to prevent moisturefrom infiltrating into the organic light emitting device 20.

The encapsulation layer 130 may include at least one sandwich structurein which at least one organic layer is interposed between at least twoinorganic layers. Also, the encapsulation layer 130 may include at leastone sandwich structure in which at least one inorganic layer isinterposed between at least two organic layers.

The encapsulation layer 130 may include a first inorganic layer, a firstorganic layer, and a second inorganic layer in the stated order from theupper portion of the display unit 120. Also, the encapsulation layer mayinclude a first inorganic layer, a first organic layer, a secondinorganic layer, a second organic layer, and a third inorganic layer inthe stated order from the upper portion of the display unit 120.Otherwise, the encapsulation layer 130 may include a first inorganiclayer, a first organic layer, a second inorganic layer, a second organiclayer, a third inorganic layer, a third organic layer, and a fourthinorganic layer in the stated order from the upper portion of thedisplay unit 120.

A halogenated metal layer including LiF may be additionally disposedbetween the display unit 120 and the first inorganic layer. Thehalogenated metal layer may prevent damage to the display unit 120 whenthe first inorganic layer is formed by a sputtering method or a plasmadeposition method.

The first organic layer has an area that is less than that of the secondinorganic layer, and the second organic layer may have an area that isless than that of the third inorganic layer. Also, the first organiclayer is completely covered by the second inorganic layer, and thesecond organic layer may be completely covered by the third inorganiclayer.

FIG. 2 is a cross-sectional view schematically showing a part of anorganic light emitting display apparatus 2 according to anotherembodiment of the present invention.

Hereinafter, differences of the organic light emitting display apparatus2 of the present embodiment from the organic light-emitting displayapparatus 1 will be described below. Here, like reference numeralsdenote the same elements performing the same function.

In reference to FIG. 2, the organic light emitting display apparatus 2may include the substrate 110, the display unit 120, the encapsulationlayer 130, the integrated circuit device 140, and a transparentprotection unit (window) 150.

The display unit 120 may be disposed on the substrate 110, and theencapsulation layer 130 may be formed to cover the display unit 120.Also, the integrated circuit device 140 may be disposed on the substrate110 at an outer side of the display unit 120. Also, the transparentprotection unit 150 may be disposed on the encapsulation layer 130. Thetransparent protection unit 150 and the integrated circuit device 140are separated from and spaced apart from each other.

The integrated circuit device 140 may be disposed on the substrate 110at the outer side of the display unit 120 to control light emission fromthe display unit 120. That is, the integrated circuit device 140 may bedisposed on the substrate 110 as a COG type. In this case, theintegrated circuit device 140 may be disposed under the transparentprotection unit 150 that is disposed on the display unit 120. Also, theintegrated circuit device 140 may be disposed at an edge portion of thesubstrate 110.

The transparent protection unit 150 may be disposed on the encapsulationlayer 130. Also, the transparent protection unit 150 may be separatedfrom the integrated circuit unit 140. The transparent protection unit150 may be attached to a housing (not shown) by an adhesive member (notshown). Also, the transparent protection unit 150 may extend so as tohave a length that is longer than that of the substrate 110. Inaddition, the integrated circuit device 140 may be disposed under thetransparent protection unit 150.

A second recess 153 may be formed in a portion of the transparentprotection unit 150, which geometrically corresponds to the integratedcircuit device 140. The second recess 153 may be formed when thetransparent protection unit 150 is formed, or may be formed by forming atransparent protection unit having flat surfaces and etching a part ofthe transparent protection unit by using an etchant or a laser ablationmethod. In addition, a part of the integrated circuit device 140 may bein the second recess 153. Also, a depth D2 of the second recess 153 maybe less than the thickness T1 of the integrated circuit device 140.

A buffer unit 156 may be formed in the second recess 153 that is formedin the transparent protection unit 150. In one embodiment, the bufferunit 156 may be formed on the bottom surface B′ of the second recess 153facing towards the substrate 110. The buffer unit 156 may be formed ofsynthetic resin such as rubber having a cushion. Since the second recess153 is formed in the transparent protection unit 150, a thickness of theregion where the second recess 153 is formed is reduced. Here, byforming the buffer unit 156 in the second recess 153, the region of thetransparent protection unit 150, which has the reduced thickness, may bereinforced. Also, the buffer unit 156 may reduce the shock applied tothe integrated circuit device 140 if the integrated circuit device 140and the transparent protection unit 150 contact each other due toexternal shock.

In addition, a protrusion 159 may be formed on an opposite surface tothe region where the second recess 153 is formed in the transparentprotection unit 150. The protrusion 159 may be formed of a material thatis the same as that forming a substrate of the transparent protectionunit 150. The protrusion 159 may be formed when the substrate of thetransparent protection unit 150 is formed, or may be formed additionallyafter forming a substrate of the transparent protection unit, which hasflat surfaces. Since the second recess 153 is formed in the transparentprotection unit 150, a thickness at the region where the second recess153 is formed is reduced. Therefore, by forming the protrusion 159 on anopposite surface to the region where the second recess 153 is formed inthe transparent protection unit 150, the region of the transparentprotection unit 150 having the reduced thickness may be reinforced.

The thickness T1 of the integrated circuit device 140 may be greaterthan or less than the sum T2 of the thickness of the display unit 120and the thickness of the encapsulation layer 130.

In a case where the thickness T1 of the integrated circuit device 140 isless than the sum T2 of the thickness of the display unit 120 and thethickness of the encapsulation unit 130, when the integrated circuitdevice 140 is disposed on the outer side of the display unit 120 andunder the transparent protection unit 150 on the substrate 110, theintegrated circuit device 140 may be separated from the transparentprotection unit 150 even if the second recess 153 is not formed in thetransparent protection unit 150.

However, the thickness T1 of the integrated circuit device 140 isgenerally greater than the sum T2 of the thickness of the display unit120 and the thickness of the encapsulation unit 130. In this case, ifthe integrated circuit device 140 is disposed on the substrate 110, theintegrated circuit device 140 contacts the transparent protection unit150 disposed on the encapsulation layer 130. Since the integratedcircuit device 140 has a low breaking strength, the integrated circuitdevice 140 is vulnerable to external shock when contacting thetransparent protection unit 150.

Therefore, when the thickness T1 of the integrated circuit device 140 isgreater than the sum T2 of the thickness of the display unit 120 and thethickness of the encapsulation unit 130, the second recess 153 may beformed in the transparent protection unit 150 at a portion geometricallycorresponding to the integrated circuit device 140. Here, the depth D2of the second recess 153 may be greater than a value that is obtained bysubtracting the sum T2 from the thickness T1 of the integrated circuitdevice 140. If the integrated circuit device 140 is disposed under thesecond recess 153, the thickness T1 of the integrated circuit device 140may be less than a height H2 measured from the upper surface of thesubstrate 110 to the bottom surface B′ of the second recess 153. Thatis, since the integrated circuit device 140 is disposed under the secondrecess 153 of the transparent protection unit 150, the integratedcircuit device 140 may be separated from and spaced apart from thetransparent protection unit 150. Thus, since the integrated circuitdevice 140 is separated from the transparent protection unit 150, adirect transfer of an external shock to the integrated circuit device140 may be prevented. As such, damage to the integrated circuit device140 may be prevented to improve reliability thereof while forming theslim organic light emitting display apparatus 2.

FIG. 3 is a cross-sectional view schematically showing an organic lightemitting display apparatus 3 according to another embodiment of thepresent invention.

Hereinafter, differences of the organic light emitting display apparatus3 of the present embodiment from the organic light-emitting displayapparatus 1 will be described below. Here, like reference numeralsdenote the same elements performing the same function.

In reference to FIG. 3, the organic light emitting display apparatus 3may include the substrate 110, the display unit 120, the encapsulationlayer 130, the integrated circuit device 140, and a transparentprotection unit (window) 150.

The display unit 120 may be disposed on the substrate 110, and theencapsulation layer 130 may be formed to cover the display unit 120.Also, the integrated circuit device 140 may be disposed on the substrate110 at an outer side of the display unit 120. Also, the transparentprotection unit 150 may be disposed on the encapsulation layer 130. Thetransparent protection unit 150 and the integrated circuit device 140are separated from each other.

A first recess 113 may be formed in the substrate 110 at an outer sideof the encapsulation layer 130. The first recess 113 may be formed whenforming the substrate 110, or may be formed by removing a part of thesubstrate 110 by using an etchant or a laser ablation method afterforming the substrate 110 having flat surfaces. In addition, theintegrated circuit device 140 may be disposed in the first recess 113. Adepth D1 of the first recess 113 may be less than a thickness T1 of theintegrated circuit device 140.

The integrated circuit device 140 may be disposed on the substrate 110at the outer side of the display unit 120 to control light emission fromthe display unit 120. That is, the integrated circuit device 140 may bedisposed on the substrate 110 as a COG type. Also, in this case, theintegrated circuit device 140 may be disposed under the transparentprotection unit 150 disposed on the display unit 120. In addition, theintegrated circuit device 140 may be disposed on an edge portion of thesubstrate 110.

The transparent protection unit 150 may be disposed on the encapsulationlayer 130. Also, the transparent protection unit 150 may be separatedfrom and spaced apart from the integrated circuit unit 140. Thetransparent protection unit 150 may be attached to a housing (not shown)by an adhesive member (not shown). Also, the transparent protection unit150 may extend so as to have a length that is longer than that of thesubstrate 110. In addition, the integrated circuit device 140 may bedisposed under the transparent protection unit 150.

The second recess 153 may be formed in a portion of the transparentprotection unit 150, which geometrically corresponds to the integratedcircuit device 140. The second recess 153 may be formed when thetransparent protection unit 150 is formed, or may be formed by forming atransparent protection unit having flat surfaces and etching a part ofthe transparent protection unit by using an etchant or a laser ablationmethod. In addition, a part of the integrated circuit device 140 may bein the second recess 153. Also, a depth D2 of the second recess 153 maybe less than the thickness T1 of the integrated circuit device 140.

The buffer unit 156 may be formed in the second recess 153 that isformed in the transparent protection unit 150. The buffer unit 156 maybe formed of synthetic resin such as rubber having a cushion. Since thesecond recess 153 is formed in the transparent protection unit 150, athickness of the region where the second recess 153 is formed isreduced. Here, by forming the buffer unit 156 in the second recess 153,the region of the transparent protection unit 150, which has the reducedthickness, may be reinforced. Also, the buffer unit 156 may reduce theshock applied to the integrated circuit device 140 if the integratedcircuit device 140 and the transparent protection unit 150 contact eachother due to external shock.

In addition, the protrusion 159 may be formed on an opposite surface tothe region where the second recess 153 is formed in the transparentprotection unit 150. The protrusion 159 may be formed of a material thatis the same as that forming a substrate of the transparent protectionunit 150. The protrusion 159 may be formed when the substrate of thetransparent protection unit 150 is formed, or may be formed additionallyafter forming a substrate of the transparent protection unit, which hasflat surfaces. Since the second recess 153 is formed in the transparentprotection unit 150, a thickness at the region where the second recess153 is formed is reduced. Therefore, by forming the protrusion 159 on anopposite surface to the region where the second recess 153 is formed inthe transparent protection unit 150, the region of the transparentprotection unit 150 having the reduced thickness may be reinforced.

The thickness T1 of the integrated circuit device 140 may be greaterthan or less than the sum T2 of the thickness of the display unit 120and the thickness of the encapsulation layer 130.

In a case where the thickness T1 of the integrated circuit device 140 isless than the sum T2 of the thickness of the display unit 120 and thethickness of the encapsulation unit 130, when the integrated circuitdevice 140 is disposed on the outer side of the display unit 120 andunder the transparent protection unit 150 on the substrate 110, theintegrated circuit device 140 may be separated from the transparentprotection unit 150 even if the first and second recesses 113 and 153are not formed in the transparent protection unit 150.

However, the thickness T1 of the integrated circuit device 140 isgenerally greater than the sum T2 of the thickness of the display unit120 and the thickness of the encapsulation unit 130. In this case, ifthe integrated circuit device 140 is disposed on the substrate 110, theintegrated circuit device 140 contacts the transparent protection unit150 disposed on the encapsulation layer 130. Since the integratedcircuit device 140 has a low breaking strength, the integrated circuitdevice 140 is vulnerable to external shock when contacting thetransparent protection unit 150.

Therefore, when the thickness T1 of the integrated circuit device 140 isgreater than the sum T2 of the thickness of the display unit 120 and thethickness of the encapsulation unit 130, the first recess 113 may beformed in the substrate 110 at the outer side of the encapsulation layer130 and the second recess 153 may be formed in the transparentprotection unit 150 at the portion corresponding to the integratedcircuit device 140. Here, a sum of the depth D1 of the first recess 113and the depth D2 of the second recess 153 may be greater than a valueobtained by subtracting the sum T2 of the thicknesses of the displayunit 120 and the encapsulation layer 130 from the thickness T1 of theintegrated circuit device 140. When the integrated circuit device 140 islocated in the first recess 113 under the second recess 153 as describedabove, the thickness T1 of the integrated circuit device 140 may be lessthan a height H3 from the first recess 113 to the second recess 153.That is, since the integrated circuit 140 is disposed in the firstrecess 113 and under the second recess 153 of the transparent protectionunit 150, the integrated circuit device 140 may be separated from thetransparent protection unit 150. That is, since the integrated circuitdevice 140 is separated from and spaced apart from the transparentprotection unit 150, a direct transfer of an external shock to theintegrated circuit device 140 may be prevented. Thus, damage to theintegrated circuit device 140 may be prevented to improve thereliability while forming the slim organic light emitting displayapparatus 3.

According to the aspect of the present invention, a slimmer type organiclight emitting display apparatus may be manufactured.

While the present invention has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the art that various changes in form anddetails may be made therein without departing from the spirit and scopeof the present invention as defined by the following claims.

What is claimed is:
 1. An organic light emitting display apparatuscomprising: a substrate; a display unit disposed on the substrate; anencapsulation layer covering the display unit; an integrated circuitdevice disposed on the substrate and separated from the encapsulationlayer; and a cover unit facing the substrate with the integrated circuitdevice therebetween, wherein the cover unit has a first area overlappingthe integrated circuit device and a second area different from the firstarea, and wherein the first area has a first thickness and the secondarea has a second thickness, the second thickness is greater than thefirst thickness.
 2. The organic light emitting display apparatus ofclaim 1, wherein the integrated circuit device is disposed on thesubstrate as a chip on glass (COG) type.
 3. The organic light emittingdisplay apparatus of claim 1, wherein the substrate extends longer thanthe encapsulation layer.
 4. The organic light emitting display apparatusof claim 1, wherein the cover unit is separated from the integratedcircuit device.
 5. The organic light emitting display apparatus of claim1, wherein a thickness of the integrated circuit device is greater thana sum of a thickness of the display unit and a thickness of theencapsulation layer.
 6. The organic light emitting display apparatus ofclaim 1, wherein the cover unit has a recess in the first area.
 7. Theorganic light emitting display apparatus of claim 1, wherein thesubstrate is a plastic substrate.
 8. The organic light emitting displayapparatus of claim 1, wherein the substrate has a recess, and theintegrated circuit device is disposed in the recess.
 9. The organiclight emitting display apparatus of claim 1, wherein the encapsulationlayer comprises at least one organic layer and at least one inorganiclayer.
 10. The organic light emitting display apparatus of claim 1,wherein the cover unit extends longer than the substrate.